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TA7279P/AP
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
TA7279P,TA7279AP
Dual-Bridge Drivers (for Switching between Forward and Reverse Rotation) for DC Motors
The TA7279P and TA7279AP can control a DC motor in four modes (forward rotation, reverse rotation, stop, and brake), using their bridge driver best suited for switching between forward and reverse rotation. These ICs can deliver an output current of 1.0 A (AVE.) and 3.0 A (PEAK). They can adjust the motor voltage easily because they have a circuit configuration best suited for VCR front loading, tape loading, and reel rotation as well as power supply pins separately for two sections (output and control). In addition, they can be connected directly to CMOS devices because their input current is low. Weight: 3.00 g (typ.)
Features
Wide range of operating voltage : VCC (opr.) = 6 to 18 V (P, AP), VS (opr.) = 0 to 16 V (P) / = 0 to 18 V (AP) No malfunction occurs even if VCC is higher than VS or vice versa. However, observe Vref VS. Output current up to 1.0 A (AVE.), 3.0 A (PEAK) Built-in thermal shut down circuit Built-in back electromotive force absorber diode Built-in hysteresis circuit
The TA7279P/AP: The TA7279P/AP is Sn plated product including Pb. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245C *dipping time = 5 seconds *the number of times = once *use of R-type flux
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Block Diagram
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Pin Function
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Symbol VIN2-A VIN2-A VI N1-A OUT1-A VS-A OUT2-A GND GND OUT2-B VS-B OUT1-B VIN1-B VIN2-B VCC Functional Description A-ch input terminal A-ch input terminal A-ch output terminal A-ch Motor drive power supply A-ch output terminal GND terminal B-ch output terminal B-ch Moter drive power supply B-ch output terminal B-ch input terminal B-ch input terminal Logic power supply
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Application Note
(1) Input circuit
The input circuit is an active high type, as shown in the diagram. When voltage higher than the specified VIN (H) is applied, the output is logic "H". When voltage lower than the specified VIN (L) is applied or if the input is grounded, the output is logic "L". Since the input current IN flows to the input when logic "H", be careful with the output impedance at the previous step.
(2)
Output circuit
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Function
IN1 1 0 1 0 IN2 1 1 0 0 OUT1 L L H High impedance OUT2 L H L Brake CW/CCW CCW/CW Stop Mode
Absolute Maximum Ratings (Ta = 25C)
Characteristics Supply voltage AP P AP P PEAK AVE. Symbol VCC (max) Rating 25 20 25 18 3.0 1.0 2.3 -30 to 75 -55 to 150 Unit V
Motor drive voltage
VS (max) IO (PEAK) IO (AVE.) PD (Note) Topr Tstg
V
Output current Power dissipation Operating temperature Storage temperature
A W C C
Note:
No heat sink.
Electrical Characteristics (Ta = 25C)
Characteristics Symbol ICC1 Supply current ICC2 ICC3 Input operating voltage Input current Upper Lower Upper Lower Leakage current Upper Lower Upper Lower 1 (High) 2 (Low) VIN (H) VIN (L) IIN VSATU-1 VSATL-1 VSATU-2 VSATL-2 ILU ILL VFU VFL Test Circuit 1 1 1 2 3 3 3 3 4 4 Test Condition VCC = 18 V, Output Off, Stop mode VCC = 18 V, Output Off, CW/CCW mode VCC = 18 V, Output Off, Brake mode Tj = 25C Tj = 25C Sink, VIN = 3 V IO = 0.1 A, VCC = VS = 18 V IO = 0.1 A, VCC = VS = 18 V IO = 1.0 A, VCC = VS = 18 V IO = 1.0 A, VCC = VS = 18 V VS = 25 V VS = 25 V IF = 1 A IF = 1 A Min 14 10 8 3.0 Typ. 28 29 20 3 1.2 1.05 2.5 1.3 Max 41 38 35 VCC 0.8 10 1.1 1.0 V 1.5 1.4 50 50 A V A mA Unit
Output saturation voltage
Diode forward drop
V
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Test Circuit 1
ICC1, 2, 3
Test Circuit 2
IIN (H), (L)
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Test Circuit 3
VSATU-1, 2 / VSATL-1, 2
Test Circuit 4
VFU, L
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Application Circuit
Problems may result if a capacitor is inserted in parallel to the motor. If measures against noise are necessary, connect capacitors as shown in the diagram below. A larger bypass capacitor between VCC and GND is effective against noise and other problems. (A capacitance higher than 100 F is recommended.)
Note 1: Be sure to connect the VS pins (pins 5 and 10) directly to each other. Note 2: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. Note 3: When turning on the power for the ICs, apply VS after VCC (or VCC and VS simultaneously). When shutting off the power, drop VS before VCC (or VS and VCC simultaneously). When turning on the power (VCC), keep both the inputs (IN1 and IN2) on a low level.
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Package Dimensions
Weight: 3.00 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing charts may be simplified for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
2. Equivalent Circuits
3. Timing Charts
4. Application Circuits
5. Test Circuits
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
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Points to remember on handling of ICs
(1) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (2) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (3) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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